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Thermal Compound Paste for CPU & Chipsets, 30g

Rs. 799.00
Rs. 1,199.00
Rs. 799.00
(-33%)

ⓘ Price & availability are subject to final order validation. If an adjustment is required due to size, weight or shipping requirements, we'll contact you before processing your order.

10 customers are viewing this product
Subtotal: Rs. 799.00
Overseas

Ships from our international warehouse ! This item ships from our international warehouse to bring you a wider range of products. Delivery may take a little longer, but all duties and taxes are included — there are no additional charges on delivery.


Estimated to be delivered between 27/09/2026 - 08/10/2026

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Free Shipping

Free standard shipping on prepaid orders

img_10257659

Thermal Compound Paste for CPU & Chipsets, 30g

Rs. 1,199.00 Rs. 799.00
img_10257659
img_10257660
img_10257661
img_10257662

Thermal Compound Paste for CPU & Chipsets, 30g

Rs. 1,199.00 Rs. 799.00
Description

Description:

Ensure optimal heat transfer with this thermal compound paste, designed for use in coolers and heat sinks for CPUs and chipsets. The 30g tube provides ample paste for multiple applications, making it essential for computer builders and enthusiasts. A practical gift for tech lovers and DIY PC builders.

Features:

  • 30g tube provides enough thermal paste for several applications.
  • Designed for effective heat transfer in CPUs and chipsets for optimal performance.
  • Easy to apply, ensuring a smooth and even layer for maximum efficiency.
  • Essential for computer builders and enthusiasts looking to improve cooling.
  • A valuable gift for tech lovers and DIY PC builders.

Additional Info:

  • size : Pack of 1
  • Material : ISOL 6, Heat Sink Compound. Colour : Grey, Packing Type : Injection, Weight : Approx. 30 g
  • Generally used as a thermal coupling of electrical / electronic devices to heat sinks such as base or mounting studs of transistors, diodes and rectifiers
  • It is used for maintaining a positive heat-sink seal that improves heat transfer from the electrical / electronic component / device to the heat sink or chassis, there by increasing the overall efficiency of the component / device
  • High thermal conductivity low thermal resistance electrically non-conductive, non-curing, non-capacitive, non-corrosive bleed resistant temp resistant from -50 to 210 C
  • Composed of carbon micro-particles which lead to an extremely high thermal conductivity. It guarantees that heat generated from the CPU or GPU is dissipated efficiently.
Shipping & Return

Shipping

We provide shipping to all parts of India, with warehouses located within the country and abroad. Delivery times typically range from 2 to 14 days, depending on the destination and the dispatch location.

When you place an order, we will provide an estimated shipping and delivery timeline based on item availability and your chosen shipping method. Most items qualify for free shipping when prepaid payment is selected.

Occasionally, a product may be out of stock due to high demand. However, we replenish our inventory quickly, and your order will be shipped as soon as possible. In such cases, our customer service team will contact you with a delivery estimate. Whenever possible, we also offer a free upgrade to express shipping.

Returns Policy

You may return most new, unopened items within 7 days of delivery for a full refund. We'll also pay the return shipping costs if the return is a result of our error (you received an incorrect or defective item, etc.).

You should expect to receive your refund within 3-5 days of receiving your return package, however, in many cases you will receive a refund more quickly.

If you need to return an item, please contact us and our support team will assist you.

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